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Advanced Semiconductor Packaging Market to Register a CAGR of 10.9% during 2017-2026

by Akashp56 · June 21, 2019

Semiconductor packaging provides protection to substrate and wafer. The materials used in packaging semiconductor are metal, plastic Authentic Joe Panik Jersey , ceramic or glass. However, manufacturers have started using some of the advanced semiconductor packaging technologies such as flip-chip, Fan-Out Wafer-Level Packaging (FO-WLP), Fan-In Wafer-Level Packaging (FI-WLP) and 2.5D and 3D packaging. Although 2.5D technology emerged as a bridge technology between 2D and 3D ICs, it has evolved as largely used package solution alongside 3D ICs. The demand for 3D packaging is increasing due to constantly evolving wearable and portable devices Authentic Evan Longoria Jersey , and rapid development of electric vehicles. Also, High-Bandwidth Memory (HBM) technology is which is already implemented in 2.5D packaging is also expected to improve the power efficiency of IC packages.